中文  |  English

产品及应用Products & Applications

PCB及半导体MRO一站式采购服务中心

  • 产品详情
消泡剂
Defoamer
无硅,水溶性好No silicon, good water solubility
无残留,消泡迅速抑泡持久No residue, foam elimination quickly and lasting 适用MSAP HDI显景*及去膜Suitable for MSAP/ HDI developing and stripping


成分 Ingredient

聚醒、水PPG,H2O

工作温度Operating Temperature

<80°C

配比 Proportion

l~2%o

特点 Feature

无残留适用任何精密制程No residue, suitable for any precision process

包装 Packing

25L/25L/PD


*图片仅供参考,产品形态及包装方式以实物为准

  Pictures are only for information, take practicality as standard

>>