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防焊退洗液
Solder mask stripping agent
不伤及铜面与基材
Does not damage the copper surface and the substrate 易清洗，无残留Easy to clean, no residue 退洗后铜面光亮,无氧化发红现象
Solder mask stripping agent
不伤及铜面与基材
Does not damage the copper surface and the substrate 易清洗，无残留Easy to clean, no residue 退洗后铜面光亮,无氧化发红现象
The copper surface keep bright after stripping, no oxidative redness 孔渗透性好,剥除效率高
High stripping efficiency and the hole permeability is good 适用无卤基材Apply to HF substrate 无味、环保、安全Odorless,environment friendly, safe.
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成分 Ingredient |
有机酸、缓蚀剂、掩蔽剂、水 Oganic acid, inhibiter and chelant |
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工作温度。perate Temp |
20-35°C |
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添加量 Proportion |
1-2% |
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特点 Feature |
无残留,适用任何精密制程No residue, suitable for any precision process |
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包装 Packing |
20L/桶 20L/PD |